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High Automation Bga X Ray Machine For Dry Joint Detection And Analysis

    Buy cheap High Automation Bga X Ray Machine For Dry Joint Detection And Analysis from wholesalers
     
    Buy cheap High Automation Bga X Ray Machine For Dry Joint Detection And Analysis from wholesalers
    • Buy cheap High Automation Bga X Ray Machine For Dry Joint Detection And Analysis from wholesalers

    High Automation Bga X Ray Machine For Dry Joint Detection And Analysis

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    Brand Name : UNICOMP
    Model Number : AX8500
    Certification : CE, FDA
    Price : can negotiate
    Payment Terms : T/T, L/C
    Supply Ability : 300 sets per month
    Delivery Time : 30 days
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    High Automation Bga X Ray Machine For Dry Joint Detection And Analysis

    Dry joint detection and analysis BGA X-Ray Inspection Machine​


    X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. ( Offline X - Ray series ) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on.


    ItemDefinitionSpecs
    Motion Control SystemMotion Control ModeMouse&Joystick&Keyboard
    Max.Load Dimension500x500mm
    Max.Detection Dimension350x450mm
    Tilt Detection Angle60°
    X-Ray SystemTube TypeClosed
    Voltage/Current100kv/200μA
    Focal Spot Size5μm
    FPD DetectorFPD
    Physical & Image Processing ParametersLength x Width x Height1250 x 1300 x 1900 mm
    Weight1500 kg
    Power2kW
    System Magnification500 x
    Leakage Dose<1μSv/h

    X-ray Inspecting Features:
    (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.


    (2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such

    as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.


    (3) The test preparation time is greatly reduced.


    (4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.


    (5) Double layers board and multi-layer boards only one check (with layered function).


    (6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.


    Inspection Images:


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