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BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage

    Buy cheap BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage from wholesalers
     
    Buy cheap BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage from wholesalers
    • Buy cheap BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage from wholesalers

    BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage

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    Brand Name : UNICOMP
    Model Number : AX9100
    Certification : CE, FDA
    Price : can negotiate
    Payment Terms : T/T, L/C
    Supply Ability : 300 sets per month
    Delivery Time : 30 days
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    BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage

    SMT , BGA , CSP , Flip Chip , LED BGA X Ray Inspection Machine


    Unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system.


    ItemDefinitionSpecs
    System ParametersSize1350(L)x1250(W)x1700(H)mm
    Weight1900kg
    Power220AC/50Hz
    Power Consumption1.6kW
    X-ray TubeTypeClosed
    Max.Voltage130kV
    Max.Power40W
    Spot Size7μm
    X-ray SystemIntensifierFPD
    Monitor22 ‘’LCD
    System Magnification1600 X
    Detection RegionMax.Loading SizeΦ570mm
    Max.Inspection Area450mm x 450mm
    X-ray Leakage<1μSv/h

    X-ray Inspecting Features:


    (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.


    (2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.


    (3) The test preparation time is greatly reduced.


    (4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.


    (5) Double layers board and multi-layer boards only one check (with layered function).


    (6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.


    Test Images:


    Quality BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage for sale
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