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EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection

    Buy cheap EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection from wholesalers
     
    Buy cheap EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection from wholesalers
    • Buy cheap EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection from wholesalers

    EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection

    Ask Lasest Price
    Brand Name : UNICOMP
    Model Number : AX8200
    Certification : CE, FDA
    Price : can negotiate
    Payment Terms : T/T, L/C
    Supply Ability : 300 sets per month
    Delivery Time : 30 days
    • Product Details
    • Company Profile

    EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection

    EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection


    The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 is capable of addressing small and large volume factory requirements. (Contact us for details)



    OUR SERVICE

    1. Your inquiry will be replied in 12 hours.

    2. Original Manufacture to customers, with competitive price.

    3. We provide one year warranty, free training and whole life technology support.

    4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,
    and will give you the tracking NO. after shipment.


    5. Well-trained and Professional after-sales service team to support you.

    6. Manual will package with machine . It will show you how to use machine step by step.

    7. Items are only shipped after payment is received.



    Applications

    BGA Inspection

    Inspection of over molded electrical connectors

    Encapsulated components

    Aluminum die castings

    Molded plastic components

    Ceramics

    Aerospace components

    Electrical / mechanical components

    Electronic components

    SMT assemblies

    Pharmaceuticals

    Automotive assemblies

    Agriculture

    Counterfeit inspection

    Cell phone battery inspection


    Item

    Definition

    Specs

    System Parameters

    Size

    1080(L)x1180(W)x1730(H)mm

    Weight

    1150kg

    Power

    220AC/50Hz

    Power Consumption

    0.8kW

    X-ray Tube

    Type

    Closed

    Max.Voltage

    90kV/100kV

    Max.Power

    8W

    Spot Size

    5μm

    X-ray System

    Intensifier

    4"Image Intensifier

    Monitor

    22"LCD

    System Magnification

    600x

    Detection Region

    Max.Loading Size

    510mm x 420mm

    Max.Inspection Area

    435mm x 385mm

    X-ray Leakage

    < 1uSv/h


    AX8200.pdf




















































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