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Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor

    Buy cheap Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor from wholesalers
     
    Buy cheap Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor from wholesalers
    • Buy cheap Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor from wholesalers

    Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor

    Ask Lasest Price
    Brand Name : UNICOMP
    Model Number : AX8200
    Certification : CE, FDA
    Price : can negotiate
    Payment Terms : T/T, L/C
    Supply Ability : 300 sets per month
    Delivery Time : 30 days
    • Product Details
    • Company Profile

    Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor

    Highly flexible and cost effective electronics and semiconductor X Ray Machine


    X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer.


    X-ray Inspecting Features:


    (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.


    (2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.


    (3) The test preparation time is greatly reduced.


    (4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.


    (5) Double layers board and multi-layer boards only one check (with layered function).


    (6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.


    Item

    Definition

    Specs

    System Parameters

    Size

    1080(L)x1180(W)x1730(H)mm

    Weight

    1150kg

    Power

    220AC/50Hz

    Power Consumption

    0.8kW

    X-ray Tube

    Type

    Closed

    Max.Voltage

    90kV/100kV

    Max.Power

    8W

    Spot Size

    5μm

    X-ray System

    Intensifier

    4"Image Intensifier

    Monitor

    22"LCD

    System Magnification

    600x

    Detection Region

    Max.Loading Size

    510mm x 420mm

    Max.Inspection Area

    435mm x 385mm

    X-ray Leakage

    < 1uSv/h



    Inspection Images:

    AX8200.pdf


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