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Real Time Digital X-Ray Machine AX7900 For Chip Inner Defects Inspection

    Buy cheap Real Time Digital X-Ray Machine AX7900 For Chip Inner Defects Inspection from wholesalers
     
    Buy cheap Real Time Digital X-Ray Machine AX7900 For Chip Inner Defects Inspection from wholesalers
    • Buy cheap Real Time Digital X-Ray Machine AX7900 For Chip Inner Defects Inspection from wholesalers

    Real Time Digital X-Ray Machine AX7900 For Chip Inner Defects Inspection

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    Brand Name : UNICOMP
    Model Number : AX7900
    Certification : CE, FDA
    Price : can negotiate
    Payment Terms : T/T, L/C
    Supply Ability : 300 sets per month
    Delivery Time : 30 days
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    Real Time Digital X-Ray Machine AX7900 For Chip Inner Defects Inspection

    Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment



    Description of IC X-Ray machine AX7900:


    90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.


    APPLICATION of IC Xray machine AX7900:

    • LED, SMT, BGA, CSP, Flip Chip Inspection.
    • Semiconductor, Packaging components, Battery Industry.
    • Electronic components, Auto parts, Photovoltaic Industry.
    • Aluminum Die Casting, Moulding Plastic.
    • Ceramics, Other Special Industries

    FEATURES of IC Xray machine AX7900:

    • 90KV 5μm X-ray tube, FPD Detector.
    • Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
    • Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option).
    • Multi-function DXI image processing system.
    • X/Y programming function for multiple image inspection routines
    • Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
    • BGA void/area auto-measurement plus report generation.

    Technical Specifications of AX7900


    ItemDefinitionSpecs
    System ParametersSize1100(L)x1100(W)x1500(H)mm
    Weight1000kg
    Power220AC/50Hz
    Power Consumption0.8kW
    X-ray TubeTypeClosed
    Max.Voltage80kV/90kV
    Max.Power12W/8W
    Spot Size5μm/15μm
    X-ray SystemIntensifierFPD
    Monitor22 ‘’LCD
    System Magnification160 X/360X
    Detection RegionMax.Loading Size440mm x 400mm
    Max.Inspection Area420mm x 380mm
    X-ray Leakage<1μSv/h

    Inspection Images of IC X-Ray machine AX7900:


    Real Time Digital X-Ray Machine AX7900 For Chip Inner Defects Inspection

    Quality Real Time Digital X-Ray Machine AX7900 For Chip Inner Defects Inspection for sale
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