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PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection

    Buy cheap PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection from wholesalers
     
    Buy cheap PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection from wholesalers
    • Buy cheap PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection from wholesalers

    PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection

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    Brand Name : UNICOMP
    Model Number : AX7900
    Certification : CE, FDA
    Price : can negotiate
    Payment Terms : T/T, L/C
    Supply Ability : 300 sets per month
    Delivery Time : 30 days
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    PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection

    PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection


    Description of IC Xray machine AX7900:

    90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.


    FEATURES of IC Xray machine AX7900:

    1. 90KV 5μm X-ray tube, FPD Detector.
    2. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
    3. Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).
    4. Multi-function DXI image processing system.
    5. X/Y programming function for multiple image inspection routines
    6. Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
    7. BGA void/area auto-measurement plus report generation.

    APPLICATION of IC Xray machine AX7900:

    1. LED, SMT, BGA, CSP, Flip Chip Inspection.
    2. Semiconductor, Packaging components, Battery Industry.
    3. Electronic components, Auto parts, Photovoltaic Industry.
    4. Aluminum Die Casting, Moulding Plastic.
    5. Ceramics, Other Special Industries

    Technical Specifications

    ItemDefinitionSpecs
    System ParametersSize1100(L)x1100(W)x1500(H)mm
    Weight1000kg
    Power220AC/50Hz
    Power Consumption0.8kW
    X-ray TubeTypeClosed
    Max.Voltage80kV/90kV
    Max.Power12W/8W
    Spot Size5μm/15μm
    X-ray SystemIntensifierFPD
    Monitor22 ‘’LCD
    System Magnification160 X/360X
    Detection RegionMax.Loading Size440mm x 400mm
    Max.Inspection Area420mm x 380mm
    X-ray Leakage<1μSv/h



    Inspection Images of IC Xray machine AX7900:


    Quality PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection for sale
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